3D Inspection

 
 

Koh Young - Automatic Optical Inspection (AOI)

World-Fastest Full 3D Automated Optical Inspection

- High-speed full 3D AOI that brings about a revolution in SMT process management

- Industry-leading speed for full 3D measuring inspection equipment skill solutions

- Only solution in the industry to set inspection criteria according to IPC-610 standards

- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors

- Powerful 3D solder joint inspection

- Full 3D data-based process optimization solution: Realization of industry 4.0 / smart factory

- The model with the best specification, suitable for variety of production environments

Automated optical inspection (AOI) is an automated visual inspection of printed circuit boards (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). 

 

Koh Young - Solder Paste Inspection (SPI)

World-Best Performance 3D Solder Paste Inspection

- Industry-leading measurement accuracy and inspection reliability

- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction

- Full 3D foreign material inspection solution for the entire PCB

- Full 3D data-based process optimization solution: Realization of industry 4.0 / smart factory

- Real-time process optimization through powerful SPC analytics

- Maintain optimal equipment status with the embedded self-diagnosis function

- The model with the best specification, suitable for variety of production environments

- Full 3D data-based process optimization solution: Realization of industry 4.0 / smart factory

SPI systems measure the volume of the solder pads before the components are applied and the solder melted. SPI systems can reduce the incidence of solder-related defects to statistically insignificant amounts.